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Thermal/Mechanical Design Guide 87

Embedded Thermal Solutions

E Embedded Thermal Solutions

This section describes the LV processors and Embedded reference heatsinks for NEBS

(Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications

Computing Architecture) systems. These LV processors are good for any form factor

that needs to meet NEBS requirements.

E.1 Performance Targets

Table E-1 provides boundary conditions and performance targets for 1U and ATCA

heatsinks. These values are used to generate processor thermal specifications and to

provide guidance for heatsink design.

Notes:

1. Local ambient temperature of the air entering the heatsink.

2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).

3. Reference system configuration. In a single wide ATCA blade the 60 W processor should be used in single

socket only and the 38 W processor can be used in dual socket.

4. Local Ambient Temperature written 50/65

C means 50

C under Nominal conditions but 65

C is allowed for

Short-Term NEBS excursions.

5. Passive heatsinks with TIM.

6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.

Table E-1. Boundary Conditions and Performance Targets

Parameter Value Value

Altitude, system ambient temp

Nominal/Short-term

Sea level, 40

C/55C Sea level, 40

C/55C

TDP 60 W 38 W

1,4

51.9/66.9

C 50/65

0.302

C/W 0.532

C/W

System height (form factor)

1U (EEB) or ATCA ATCA

Heatsink volumetric 1U (90 x 90 x 27) or Custom ATCA

(90 x 90 x 13mm + heat

exchanger)

ATCA (90 x 90 x 13 mm)

Heatsink technology

Cu base, Cu fins

1 2 ... 82 83 84 85 86 87 88 89 90 91 92 ... 97 98

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