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Thermal/Mechanical Design Guide 41
Thermal Solutions
compliance by ensuring that the processor Tcase value, as measured on the TTV, does
not exceed Tcase_max_B at the anomalous power level for the environmental condition
of interest. This anomalous power level is equal to 75% of the TDP limit.
5.7.2 Thermal Excursion Power for 80 W Processor
Under fan failure or other anomalous thermal excursions, Tcase may exceed the
thermal profile for a duration totaling less than 360 hours per year without affecting
long term reliability (life) of the processor. For more typical thermal excursions,
Thermal Monitor is expected to control the processor power level as long as conditions
do not allow the Tcase to exceed the temperature at which Thermal Control Circuit
(TCC) activation initially occurred. Under more severe anomalous thermal excursions
when the processor temperature cannot be controlled at or below this Tcase level by
TCC activation, then data integrity is not assured. At some higher threshold,
THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to
the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal
excursion compliance by ensuring that the processor Tcase value, as measured on the
TTV, does not exceed Tcase_max at the anomalous power level for the environmental
condition of interest. This anomalous power level is equal to 75% of the TDP limit.
5.7.3 Absolute Processor Temperature
Intel does not test any third party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the TCC (thermal control circuit)
activation temperature, use of software that reports absolute temperature can be
misleading.
See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for details
regarding use of IA32_TEMPERATURE_TARGET register to determine the minimum
absolute temperature at which the TCC will be activated and PROCHOT# will be
asserted.
§
- March 2009 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- 2 LGA1366 Socket 13
- LGA1366 Socket 14
- 2.1 Board Layout 15
- 2.2 Attachment to Motherboard 16
- 2.3 Socket Components 16
- 2.3.3 Contacts 17
- 2.3.4 Pick and Place Cover 17
- 2.5 Durability 19
- 2.6 Markings 19
- 2.8 Socket Size 19
- 3 Independent Loading 21
- Threaded studs 23
- Clearance hole 23
- Threaded nuts 23
- Figure 3-3. ILM Assembly 24
- Protrusion 25
- 4 LGA1366 Socket and ILM 27
- 4.4 Loading Specifications 28
- 4.5 Electrical Requirements 28
- 5 Thermal Solutions 31
- Thermal Solutions 32
- 5.1.1 25.5 mm Tall Heatsink 33
- 5.2 Heat Pipe Considerations 34
- 5.3 Assembly 35
- 5.4 Structural Considerations 36
- 5.5 Thermal Design 36
- 5.5.2 Dual Thermal Profile 37
- 5.6 Thermal Features 38
- 5.6.1.1 T 39
- Guidance 39
- 5.7 Thermal Guidance 40
- 6 Quality and Reliability 43
- 6.2.2 Post-Test Pass Criteria 45
- A Component Suppliers 47
- Item Intel PN Foxconn Tyco 49
- Supplier Contact Info 49
- Component Suppliers 50
- B Mechanical Drawings 51
- Mechanical Drawings 52
- AS VIEWED FROM SECONDARY SIDE 54
- OF THE MOTHERBOARD 54
- (DETAILS) 54
- LEGEND, THIS SHEET ONLY 54
- SECONDARY SIDE 55
- 3D HEIGHT RESTRICTION ZONES 55
- PRIMARY SIDE 55
- 03D89880D 60
- SCREW, SHOULDER, M3 X 0.5 60
- C Socket Mechanical Drawings 79
- Socket Mechanical Drawings 80
- D Heatsink Load Metrology 85
- Heatsink Load Metrology 86
- E Embedded Thermal Solutions 87
- E.2 Thermal Design Guidelines 88
- Thermal Profile 89
- Embedded Thermal Solutions 90
- F Processor Installation Tool 97
- Processor Installation Tool 98
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