IBM Intel Xeon E5506 Spezifikationen Seite 29
- Seite / 98
- Inhaltsverzeichnis
- LESEZEICHEN
Bewertet. / 5. Basierend auf Kundenbewertungen
Thermal/Mechanical Design Guide 29
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4.6 Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this chapter are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in Figure 4-1.
Table 4-4. Electrical Requirements for LGA1366 Socket
Parameter Value Comment
Mated loop inductance, Loop
<3.9nH
The inductance calculated for two contacts,
considering one forward conductor and one return
conductor. These values must be satisfied at the
worst-case height of the socket.
Mated partial mutual inductance, L
NA
The inductance on a contact due to any single
neighboring contact.
Maximum mutual capacitance, C.
<1 pF
The capacitance between two contacts
Socket Average Contact Resistance
(EOL)
15.2 mΩ
The socket average contact resistance target is
derived from average of every chain contact
resistance for each part used in testing, with a
chain contact resistance defined as the resistance
of each chain minus resistance of shorting bars
divided by number of lands in the daisy chain.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land.
Max Individual Contact Resistance
(EOL)
≤ 100 mΩ
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
Bulk Resistance Increase
≤ 3 mΩ
The bulk resistance increase per contact from
24 °C to 107 °C
Dielectric Withstand Voltage
360 Volts RMS
Insulation Resistance
800 MΩ
- March 2009 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- 2 LGA1366 Socket 13
- LGA1366 Socket 14
- 2.1 Board Layout 15
- 2.2 Attachment to Motherboard 16
- 2.3 Socket Components 16
- 2.3.3 Contacts 17
- 2.3.4 Pick and Place Cover 17
- 2.5 Durability 19
- 2.6 Markings 19
- 2.8 Socket Size 19
- 3 Independent Loading 21
- Threaded studs 23
- Clearance hole 23
- Threaded nuts 23
- Figure 3-3. ILM Assembly 24
- Protrusion 25
- 4 LGA1366 Socket and ILM 27
- 4.4 Loading Specifications 28
- 4.5 Electrical Requirements 28
- 5 Thermal Solutions 31
- Thermal Solutions 32
- 5.1.1 25.5 mm Tall Heatsink 33
- 5.2 Heat Pipe Considerations 34
- 5.3 Assembly 35
- 5.4 Structural Considerations 36
- 5.5 Thermal Design 36
- 5.5.2 Dual Thermal Profile 37
- 5.6 Thermal Features 38
- 5.6.1.1 T 39
- Guidance 39
- 5.7 Thermal Guidance 40
- 6 Quality and Reliability 43
- 6.2.2 Post-Test Pass Criteria 45
- A Component Suppliers 47
- Item Intel PN Foxconn Tyco 49
- Supplier Contact Info 49
- Component Suppliers 50
- B Mechanical Drawings 51
- Mechanical Drawings 52
- AS VIEWED FROM SECONDARY SIDE 54
- OF THE MOTHERBOARD 54
- (DETAILS) 54
- LEGEND, THIS SHEET ONLY 54
- SECONDARY SIDE 55
- 3D HEIGHT RESTRICTION ZONES 55
- PRIMARY SIDE 55
- 03D89880D 60
- SCREW, SHOULDER, M3 X 0.5 60
- C Socket Mechanical Drawings 79
- Socket Mechanical Drawings 80
- D Heatsink Load Metrology 85
- Heatsink Load Metrology 86
- E Embedded Thermal Solutions 87
- E.2 Thermal Design Guidelines 88
- Thermal Profile 89
- Embedded Thermal Solutions 90
- F Processor Installation Tool 97
- Processor Installation Tool 98
Whirlpool GC751TX manuály
Uživatelské manuály a uživatelské příručky pro Sporáky Whirlpool GC751TX.
Poskytujeme 1 manuály pdf Whirlpool GC751TX ke stažení zdarma podle typů dokumentů: Návod k použití
Kommentare zu diesen Handbüchern