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2 Thermal/Mechanical Design Guide
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® Xeon® processor 5500 series and LGA1366 socket may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,
not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor
numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to
represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not
necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost
Technology performance varies depending on hardware, software and overall system configuration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2009, Intel Corporation.
- March 2009 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- 2 LGA1366 Socket 13
- LGA1366 Socket 14
- 2.1 Board Layout 15
- 2.2 Attachment to Motherboard 16
- 2.3 Socket Components 16
- 2.3.3 Contacts 17
- 2.3.4 Pick and Place Cover 17
- 2.5 Durability 19
- 2.6 Markings 19
- 2.8 Socket Size 19
- 3 Independent Loading 21
- Threaded studs 23
- Clearance hole 23
- Threaded nuts 23
- Figure 3-3. ILM Assembly 24
- Protrusion 25
- 4 LGA1366 Socket and ILM 27
- 4.4 Loading Specifications 28
- 4.5 Electrical Requirements 28
- 5 Thermal Solutions 31
- Thermal Solutions 32
- 5.1.1 25.5 mm Tall Heatsink 33
- 5.2 Heat Pipe Considerations 34
- 5.3 Assembly 35
- 5.4 Structural Considerations 36
- 5.5 Thermal Design 36
- 5.5.2 Dual Thermal Profile 37
- 5.6 Thermal Features 38
- 5.6.1.1 T 39
- Guidance 39
- 5.7 Thermal Guidance 40
- 6 Quality and Reliability 43
- 6.2.2 Post-Test Pass Criteria 45
- A Component Suppliers 47
- Item Intel PN Foxconn Tyco 49
- Supplier Contact Info 49
- Component Suppliers 50
- B Mechanical Drawings 51
- Mechanical Drawings 52
- AS VIEWED FROM SECONDARY SIDE 54
- OF THE MOTHERBOARD 54
- (DETAILS) 54
- LEGEND, THIS SHEET ONLY 54
- SECONDARY SIDE 55
- 3D HEIGHT RESTRICTION ZONES 55
- PRIMARY SIDE 55
- 03D89880D 60
- SCREW, SHOULDER, M3 X 0.5 60
- C Socket Mechanical Drawings 79
- Socket Mechanical Drawings 80
- D Heatsink Load Metrology 85
- Heatsink Load Metrology 86
- E Embedded Thermal Solutions 87
- E.2 Thermal Design Guidelines 88
- Thermal Profile 89
- Embedded Thermal Solutions 90
- F Processor Installation Tool 97
- Processor Installation Tool 98
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