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Introduction
10 Thermal/Mechanical Design Guide
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Notes:
1. Document numbers indicated in Location column are subject to change. See the appropriate Electronic
Design Kit (EDK) for the most up-to-date Document number.
2. Available at http://www.blauer-engel.de
3. Available at http://ssiforum.oaktree.com/
1.2 Definition of Terms
Table 1-1. Reference Documents
Document Location Notes
European Blue Angel Recycling Standards 2
Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 321321 1
Intel® Xeon® Processor 5500 Series Mechanical Model 321326 1
Intel® Xeon® Processor 5500 Series Thermal Model 321327 1
Entry-level Electronics Bay Specification 3
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
LGA1366 socket The processor mates with the system board through this surface mount, 1366-contact
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total
Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
- March 2009 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- 2 LGA1366 Socket 13
- LGA1366 Socket 14
- 2.1 Board Layout 15
- 2.2 Attachment to Motherboard 16
- 2.3 Socket Components 16
- 2.3.3 Contacts 17
- 2.3.4 Pick and Place Cover 17
- 2.5 Durability 19
- 2.6 Markings 19
- 2.8 Socket Size 19
- 3 Independent Loading 21
- Threaded studs 23
- Clearance hole 23
- Threaded nuts 23
- Figure 3-3. ILM Assembly 24
- Protrusion 25
- 4 LGA1366 Socket and ILM 27
- 4.4 Loading Specifications 28
- 4.5 Electrical Requirements 28
- 5 Thermal Solutions 31
- Thermal Solutions 32
- 5.1.1 25.5 mm Tall Heatsink 33
- 5.2 Heat Pipe Considerations 34
- 5.3 Assembly 35
- 5.4 Structural Considerations 36
- 5.5 Thermal Design 36
- 5.5.2 Dual Thermal Profile 37
- 5.6 Thermal Features 38
- 5.6.1.1 T 39
- Guidance 39
- 5.7 Thermal Guidance 40
- 6 Quality and Reliability 43
- 6.2.2 Post-Test Pass Criteria 45
- A Component Suppliers 47
- Item Intel PN Foxconn Tyco 49
- Supplier Contact Info 49
- Component Suppliers 50
- B Mechanical Drawings 51
- Mechanical Drawings 52
- AS VIEWED FROM SECONDARY SIDE 54
- OF THE MOTHERBOARD 54
- (DETAILS) 54
- LEGEND, THIS SHEET ONLY 54
- SECONDARY SIDE 55
- 3D HEIGHT RESTRICTION ZONES 55
- PRIMARY SIDE 55
- 03D89880D 60
- SCREW, SHOULDER, M3 X 0.5 60
- C Socket Mechanical Drawings 79
- Socket Mechanical Drawings 80
- D Heatsink Load Metrology 85
- Heatsink Load Metrology 86
- E Embedded Thermal Solutions 87
- E.2 Thermal Design Guidelines 88
- Thermal Profile 89
- Embedded Thermal Solutions 90
- F Processor Installation Tool 97
- Processor Installation Tool 98
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