IBM Intel Xeon E5506 Spezifikationen PDF herunterladen (Seite 44)

Quality and Reliability Requirements

44 Thermal/Mechanical Design Guide

8) Thermal

Performance

Using 1U heatsink and 1U airflow from

Table 5-1:

1) TTV @ 95W (Profile B), Note 1.

Using 2U heatsink and 2U airflow from

Table 5-1:

2) TTV @ 95W (Profile A), Note 1.

3) TTV @ 80W.

4) TTV @ 60W.

Using Tower heatsink and Tower airflow

from Table 5-1:

5) TTV @ 130W, Note 1.

6) TTV @ 95W (Profile A).

7) TTV @ 80W.

8) TTV @ 60W.

As verified in wind tunnel:

1) mean Ψ

+ 3s + offset not to exceed

Table 5-1 value for 95W in 1U.

2-4) mean Ψ

+ 3s + offset not to exceed

Table 5-1 value for 2U.

5-8) mean Ψ

+ 3s + offset not to exceed

Table 5-1 value for Tower.

5 heatsinks

X 8 tests by

supplier.

Note 1: 30

heatsinks X

3 tests by

Intel.

9) Thermal Cycling Required for heatpipe designs.

Temperature range at pipe in heatsink

assembly: -25C to +100C for 500 cycles.

Cycle time is 30 minutes per full cycle,

divided into half cycle in hot zone and half

in cold zone, with minimum 1min soak at

each temperature extreme for each cycle.

See Figure 6-1 for example profile.

As verified in wind tunnel:

•Mean Ψ

+ 3s + offset not to exceed

value in Table 5-1.

• Pressure drop not to exceed value in

Table 5-1.

10) Heat Pipe Burst Continuously raise oven temperature and

record the burst/leak temperatures of fully

assembled heatsinks

No failures at minimum of 300C @ 20

minutes

32 pipes

11) Heatsink Mass Design Target < 500 g All samples < 550 g 30

12) Heatsink Load Design Targets:

0.062" board = 38.7 ± 7.2 lbf (Fmin =

31.5 lbf).

0.100" board = 51.4 ± 7.9 lbf (Fmax =

59.3 lbf).

No samples < 30 lbf on 0.062" board.

5 highest load samples (from 0.062" test)

< 60 lbf on 0.100" board

Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)

Assessment Test Condition Qualification Criteria

Min

Sample

Size

1 2 ... 39 40 41 42 43 44 45 46 47 48 49 ... 97 98

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