IBM Intel Xeon E5506 Spezifikationen PDF herunterladen (Seite 18)

LGA1366 Socket

18 Thermal/Mechanical Design Guide

2.4 Package Installation / Removal

As indicated in Figure 2-6, access is provided to facilitate manual installation and

removal of the package.

To assist in package orientation and alignment with the socket:

• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for

proper orientation.

• The package substrate has orientation notches along two opposing edges of the

package, offset from the centerline. The socket has two corresponding orientation

posts to physically prevent mis-orientation of the package. These orientation

features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the

package.

See Appendix F for information regarding a tool designed to provide mechanical

assistance during processor installation and removal.

2.4.1 Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after

solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum

package height. See Section 4.2 for the calculated IHS height above the motherboard.

Figure 2-6. Package Installation / Removal Features

alignment

walls

orientation

notch

orientation

post

access

Pin1 triangle

Pin1 chamfer

alignment

walls

orientation

notch

orientation

post

access

Pin1 triangle

Pin1 chamfer

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IBM Intel Xeon E5506 Spezifikationen Seite 18